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Spray Developing Machine -
Spray Developing Machine
WH-PXY-01 type developing machine is a small automatic spray developing machine for laboratory use, suitable for 3-5 inch substrate, liquid volume range 10-500ml, maximum speed 400RPM, maximum development time 900s
1. Product introduction
The spray developing machine (WH-PXY-01) is a product independently developed by Wenhao Co., Ltd. with independent intellectual property rights. It is designed and developed for the development process in the photolithography process and can be used for silicon wafers with specifications below 5 inches. Carry out program-controlled automatic development. This equipment can completely replace the manual development link in the production process of microfluidic chips, and overcome the uncontrollable amount of developer added in the manual development process, uncontrollable silicon wafer development time, and uncontrollable development effect between silicon wafers of the same specification. It reduces the development quality problems caused by the operator's human factors and the damage of the silicon wafer.
2. Technical parameters
Speed: 0～400RPM
Liquid volume control: 10～500mL
Adaptable silicon wafer/chip: 3 inches, 4 inches, 5 inches
Developing time: 0～900s
Inlet speed: 0～100%
Power input: AC220V±10V/50HZ
Power: 100W
Weight: 20 kg
Dimensions: 410 (W) * 410 (D) * 350 (H) mm
Working environment: temperature 0℃-40 ℃, relative humidity<80%
